首页> 外文会议>International Conference on Rapid Thermal Processing for Future Semiconductor Devices(RTP 2001); 20011114-20011116; Ise-Shima,Mie; JP >Role of Rapid Thermal Processing in the Development of Disruptive and Non-disruptive Technologies for Semiconductor Manufacturing in the 21st Century
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Role of Rapid Thermal Processing in the Development of Disruptive and Non-disruptive Technologies for Semiconductor Manufacturing in the 21st Century

机译:快速热处理在21世纪半导体制造的破坏性和非破坏性技术发展中的作用

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摘要

In this paper we have analyzed the current and future prospects of RTP for semiconductor manufacturing. Current trends are in the direction of single wafer processing based manufacturing and RTP will play a very important role. We have pointed out the essential features that need to be introduced in the design of future RTP systems. Specifically, reduction of processing temperature, reduction of variance of critical device parameters and obtaining homogenous microstructures are the key issues for designing future RTP systems.
机译:在本文中,我们分析了用于半导体制造的RTP的当前和未来前景。当前的趋势是朝着基于单晶片加工的制造方向发展,RTP将扮演非常重要的角色。我们已经指出了未来RTP系统设计中需要引入的基本功能。具体而言,降低处理温度,降低关键设备参数的差异以及获得均匀的微观结构是设计未来RTP系统的关键问题。

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