Adv. Technol. Dev. Div., United Microelectron. Corp., Tainan, Taiwan;
chemical mechanical polishing; copper; deformation; reliability; BEOL chemical mechanical polishing; CMP dishing; CMP induced surface erosion; Cu; back-end-of-line; copper CMP process; copper polishing profile; dual wafer polisher; metal line sheet resistance control; pattern deformation; polished wafer extremely far edge topography; polishing slurry selections; reliability; size 28 nm; Metals; Metrology; Planarization; Resists; Surface topography; Thickness measurement;
机译:在BEOL应用中比较使用无机化学品的单晶圆和批量聚合物清洁
机译:晶圆边缘几何形状对化学机械抛光中去除速率分布的影响:晶圆边缘滚落和缺口
机译:化学机械抛光中晶片边缘轮廓的平面化
机译:BEOL铜CMP工艺对TDDB的影响,用于直接抛光28nm及更高工艺节点上的超低k介电铜互连
机译:针对先进半导体技术节点的BEOL互连堆栈的优化
机译:超声化学机械抛光与超声研磨相结合的单晶碳化硅晶片材料去除及表面生成研究
机译:磨料加工和抛光技术。硅晶片的化学机械抛光技术。