STUDY OF THE HOT SPOTS IN INTEGRATED CIRCUITS COOLED BY MICROFLUIDIC HEATSINKS

摘要

The thermal input into high-power Integrated Circuits (IC) can have local peaks or hot spots with heat fluxes far exceeding 100 W/cm~2. In this work, the temperature distribution on a microfluidic heatsink has been simulated using the FEM method. The effects of the fluid flow and thickness of the heatsink on the hot spot temperature have been studied. Simulations have been performed for a 1 cm × 1 cm heat sink loaded with 100 W/cm~2 heating power, with a 1 mm hot spot of 1000 W/cm~2 and a 3 mm hot spot of 500 W/cm~2. Heat sinks fabricated from silicon, nickel, and copper are considered. These results show that the effect of increasing the thickness of the heatsink on the peak temperature of the hot spot depends on the solid material and the fluid flow. Simulations showed that the hot spot temperature rise can be about 40% higher if a nickel heat sink is used instead of a copper heat sink.