Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China 110016;
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA;
low cycle fatigue(LCF); SnAgCu lead-free solder; microstructural effect; deformation mechanism; fatigue life;
机译:微结构对Sn-3.8Ag-0.7Cu无铅焊料低循环疲劳的影响
机译:微结构对Sn-3.8Ag-0.7Cu无铅焊料低循环疲劳的影响
机译:在低循环疲劳分析中,由BGA和MLF组件的制造差异导致的无铅焊点失效部位转变
机译:SN-3.8AG-0.7CU无铅焊料低循环疲劳的微观结构效应
机译:微观结构对TinSilverCopper焊料的本构和疲劳断裂行为的影响。
机译:基于创新的J2-Flow弹塑性模型的金属基复合材料低周疲劳疲劳破坏效应仿真
机译:热疲劳模拟优化无铅焊料的热循环试验时间
机译:Waspaloy室温和高温低周疲劳行为的微观结构效应