首页> 外文会议>International Conference on Electrical Engineering(ICEE 2009): towards a safe, reliable, sustainable, intelligent power system;ICEE 2009 >Fabrication of Cu2ZnSnS4 thin films by sulfurization process from quaternary compound for photovoltaic device applications
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Fabrication of Cu2ZnSnS4 thin films by sulfurization process from quaternary compound for photovoltaic device applications

机译:由四元化合物通过硫化工艺制备Cu2ZnSnS4薄膜,用于光伏器件

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Cu2ZnSnS4 thin films were fabricated by sulfurization of the precursor which was evaporated from quaternary compound on Mo/soda lime glass substrate. The sulfurization temperature was varied from 400℃ to 560℃. These samples were characterized by means of X-ray fluorescence analysis, electron probe microanalysis, X-ray diffraction and scanning electron microscopy. XRD studies showed that the thin film sulfurized at 560℃ had a kesterite Cu2ZnSnS4 structure with a single phase and the preferred orientation to the 112 plane. The full width at half maximum of 112 peak in XRD patterns decreased with increasing the annealing temperature. EPMA analysis showed that Zn and Sn content had nearly stoichiometric composition and Cu content was slightly rich. SEM images demonstrated that the grain size in Cu2ZnSnS4 thin films increased with increasing the annealing temperature.
机译:通过硫化前驱体制备Cu2ZnSnS4薄膜,该前驱体从四元化合物在Mo /苏打石灰玻璃基板上蒸发。硫化温度在400℃至560℃之间变化。通过X射线荧光分析,电子探针显微分析,X射线衍射和扫描电子显微镜对这些样品进行表征。 X射线衍射研究表明,在560℃硫化的薄膜具有单相的Kesterite Cu2ZnSnS4结构,其取向优选为112面。随着退火温度的升高,X射线衍射图中112个峰的半峰全宽减小。 EPMA分析表明,Zn和Sn含量具有接近化学计量的组成,Cu含量稍富。 SEM图像表明,Cu2ZnSnS4薄膜的晶粒尺寸随着退火温度的升高而增加。

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