Specific Energies in Sawing with Diamond Segments and Grinding of a Diamond Segment

摘要

An experimental study was undertaken to compare the mechanisms of two different processes to dress metal-bonded diamond segments. In one case, a piece of vitrified SiC wheel was used as workpiece and sawn by diamond segments attached to a sawblade. In another process, a diamond segment was used as workpiece and ground by an Al_2O_3 wheel. Spindle power was measured in sawing and horizontal force was monitored in grinding, in which case the latter was then used to get the consumed power in grinding. Specific energies were then calculated from the measured or converted power. For sawing of SiC wheel with the diamond sawblade, the maximum specific energy was found to be only 0.5 J/mm~3, whereas the specific energy was up to 25 J/mm~3 in the grinding of the diamond segment.