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Characterization of SiO_2/Si interface by cathodoluminescent method

机译:阴极发光法表征SiO_2 / Si界面

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摘要

The local cathodoluminescence is used to study the point defects and their depth distribution in silicon oxide and silicon. The defects formed by two-coordinate silicon (Si=Si), oxygen vacancies (Si-Si, Si-Si-Si), non-bridgen oxygen (-O), amorphous silicon and silicon nanoclusters have characteristic emission bands. High sensibility of cathodoluminescence method permits to study natural silicon oxide film, thin silicon oxide and silicon layers near the interface. In this paper an influence of the silicon type on the properties of SiO_2/Si interface is discussed. It is shown that the quality of SiO_2/Si interface depends not only on the technology process but on the silicon type and activator concentration. A high boron content in silicon leads to an increase of point defects concentration in silicon oxide and sometimes to an appearance of Si nanoclusters near the interface in the layer with 10-20 nm thickness. The concentration of intrinsic defects near the silicon oxide - n-silicon interface depends also on phosphorous concentration. But in this case low concentration of activator leads to a presence of high content of intrinsic defects in the first monolayers of silicon oxide and to a dramatical decrease of a content of these defects in films with thickness of more that 10 nm. On the contrary, the high concentration of activators leads to low content of intrinsic defects near the interface and a rise of its content in the film with thickness more that 10 nm.
机译:局部阴极发光用于研究氧化硅和硅中的点缺陷及其深度分布。由二配位硅(Si = Si),氧空位(Si-Si,Si-Si-Si),非桥氧(-O),非晶硅和硅纳米团簇形成的缺陷具有特征发射带。阴极发光法的高灵敏度允许研究天然氧化硅膜,薄氧化硅和界面附近的硅层。本文讨论了硅类型对SiO_2 / Si界面性能的影响。结果表明,SiO_2 / Si界面的质量不仅取决于工艺过程,还取决于硅的种类和活化剂的浓度。硅中的高硼含量会导致氧化硅中点缺陷浓度的增加,有时会导致在10-20 nm厚度的层中界面附近出现Si纳米团簇。氧化硅-n-硅界面附近的固有缺陷的浓度还取决于磷的浓度。但是在这种情况下,低浓度的活化剂导致在第一单层氧化硅中存在高含量的固有缺陷,并导致厚度大于10 nm的薄膜中这些缺陷的含量急剧下降。相反,活化剂的高浓度导致界面附近固有缺陷的含量较低,并且厚度大于10 nm的膜中其含量的升高。

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