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Is Backside the New Backdoor in Modern SoCs?: Invited Paper

机译:背面是现代SoC中的新后门吗?

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Modern integrated circuits (ICs) possess several countermeasures to safeguard sensitive data and information stored in the device. In recent years, semi-invasive physical attacks based on optical debugging techniques have proven to be capable of easily bypassing these security measures implemented in the chip. Optical attacks can reveal the data stored in memory, cache and register through various methods such as photon emission analysis, laser fault injection, laser voltage probing, and thermal laser stimulation. The above-mentioned methods, which employ laser scanning microscopy and photon emission microscopy, are effective because the silicon substrate is transparent to near-infrared (NIR) photons. Therefore, the most vulnerable part of an IC to optical attacks is the backside, where the chip's transistors can be accessed and probed with a NIR laser beam. Although different optical attack detection and avoidance mechanisms have been proposed, many can be circumvented and none are universal solutions for all types of optical attacks. In this study, we present a taxonomy of the different types of optical attacks and the security threats posed by each type. Then we discuss the existing prevention-detection based solutions to optical probing attacks which will set the future research direction.
机译:现代集成电路(IC)具有多种对策来保护设备中存储的敏感数据和信息。近年来,基于光学调试技术的半侵入式物理攻击已被证明能够轻松绕过芯片中实施的这些安全措施。光学攻击可以通过各种方法(例如光子发射分析,激光故障注入,激光电压探测和热激光刺激)揭示存储在内存,高速缓存和寄存器中的数据。采用激光扫描显微镜和光子发射显微镜的上述方法是有效的,因为硅衬底对于近红外(NIR)光子是透明的。因此,IC中最容易受到光学攻击的部分是背面,可以通过NIR激光束访问和探测芯片的晶体管。尽管已经提出了不同的光学攻击检测和避免机制,但是可以规避许多机制,并且没有一种针对所有类型的光学攻击的通用解决方案。在这项研究中,我们提出了不同类型的光学攻击和每种类型构成的安全威胁的分类法。然后,我们讨论了现有的基于预防检测的光学探测攻击解决方案,这将为未来的研究方向指明方向。

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