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Is Backside the New Backdoor in Modern SoCs?: Invited Paper

机译:是在现代Socs的新后门背后吗?:邀请纸

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Modern integrated circuits (ICs) possess several countermeasures to safeguard sensitive data and information stored in the device. In recent years, semi-invasive physical attacks based on optical debugging techniques have proven to be capable of easily bypassing these security measures implemented in the chip. Optical attacks can reveal the data stored in memory, cache and register through various methods such as photon emission analysis, laser fault injection, laser voltage probing, and thermal laser stimulation. The above-mentioned methods, which employ laser scanning microscopy and photon emission microscopy, are effective because the silicon substrate is transparent to near-infrared (NIR) photons. Therefore, the most vulnerable part of an IC to optical attacks is the backside, where the chip's transistors can be accessed and probed with a NIR laser beam. Although different optical attack detection and avoidance mechanisms have been proposed, many can be circumvented and none are universal solutions for all types of optical attacks. In this study, we present a taxonomy of the different types of optical attacks and the security threats posed by each type. Then we discuss the existing prevention-detection based solutions to optical probing attacks which will set the future research direction.
机译:现代集成电路(IC)具有若干对策,以保护存储在设备中的敏感数据和信息。近年来,基于光学调试技术的半侵入物理攻击已经证明能够容易地绕过芯片中实现的这些安全措施。光学攻击可以通过各种方法揭示存储在存储器中的数据,例如光子发射分析,激光故障注入,激光电压探测和热激光刺激。采用激光扫描显微镜和光子发射显微镜的上述方法是有效的,因为硅衬底对近红外(NIR)光子透明。因此,IC到光学攻击的最脆弱的部分是背面,其中芯片的晶体管可以用NIR激光束探测。尽管已经提出了不同的光学攻击检测和避免机制,但是许多可以避免许多且没有用于所有类型的光学攻击的通用解决方案。在这项研究中,我们介绍了不同类型的光学攻击和每种类型构成的安全威胁的分类。然后我们讨论基于防止检测的防止检测的解决方案,以确定未来的研究方向。

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