Inhibition of Copper Corrosion by Removal of H_2O_ 2 from CO_2-Dissolved Water Using Palladium Catalysts

摘要

We have found that the dissolution rate of a copper metal film which is easy to be corroded oxidatively in CO_2-dissolved water (CO_2 DIW) used as rinse water for wafer cleaning processes can be decreased to one-third by removal of H_2O_2 from CO_2 DIW. DIW in semiconductor factories normally contains 10-40 μg/L H_2O_2, which remains also in CO_2 DIW. We have developed a palladium-loaded monolithic anion exchange resin (Pd-M) as a catalyst that is able to remove H_2O_2 in DIW down to below 1 μg/L at an extreamly high flow rate (space velocity SV = 6000 h~(-1)), with no detectable elution of impurities.