Experiments on the mechanical behavior of anodically bonded interlayer of Pyrex Glass/Al/Si

摘要

The MEMS/NEMS devices present an attractive prospect in many areas,especially in aviation and aerospace.Anodic bonding is one of the key technologies for the manufacturing of integrated 3-D structures of these devices.In this paper,based on experiments and detailed analysis,a systematic study will be made in depth for the mechanical behavior of anodically bonded interlayer within micro-scale structures.In accordance with a typical anodically bonded structure from one kind of MEMS micro accelerometer,a series of anodic bonding and mechanical tests were completed,for the behavior of the interlayer under quasi-static loading.The paper also presents the analysis of some important factors which influence the mechanical properties of the anodically bonded structure of Pyrex 7740 Glass/Al/Si.The metal oxidation reaction,dendritic nanostructures,and fractal patterns,which taking place at the bonding interface,were scrutinized.The experimental results demonstrate the thickness effect of the intermediate layer,and that the bonding tensile strength increases with the bonding temperature and voltage,but it decreases with the increase of the thickness of Al intermediate layer.The formation of the nanostructures in the bonding interlayer is also helpful to enhance the anodic bonding strength.