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Design and Optimization of an ARM Cortex-M Based SoC for TCP/IP Communication in High Temperature Applications

机译:高温应用中用于TCP / IP通信的基于ARM Cortex-M的SoC的设计和优化

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TCP/IP protocol stacks are usually complex protocols which require a high amount of computational power for the benefit of reliable communication. Therefore, a powerful and energy demanding processing core with an operating system is needed to achieve high data rates. In communication systems that are placed in a high temperature environment, e.g. electronics close to car engines or in aerospace applications, installation space is limited, temperatures of up to 175 ℃ occur and a high energy consumption leads to further self-heating. Thus, a robust high temperature ASIC is mandatory in order to provide an energy efficient and small processing platform. Special forms of the TCP/IP stack like Lightweight IP (lwIP) or Micro IP (uIP) are built for small or even embedded processors without the need of an operating system. In this work we implemented the lwIP and uIP stacks on the ARM Cortex-MO and ARM Cortex-M3 processors and measured the throughput of the resulting System on Chips (SoC) designed for high temperature applications. The results show a relatively poor throughput of maximum 20.29 MBit/s even for the more powerful Cortex-M3 processor using the lwIP stack. Software and hardware improvements like a Direct Memory Access (DMA) mechanism and extended checksum hardware could increase the performance by 1250% resulting in 228 MBit/s. As an exemplary target application, powerline communication in high temperature environment is chosen and a Design Space Exploration (DSE) was performed on the available physical parameters of a 180 nm SOI technology, capable of operating at 175 ℃. Results show that the best performing processor-software-combination is the Cortex-MO which has a size of only 0.374 mm2 and a power consumption of less than 1 mW at 10 MBit/s targeted throughput for the powerline application running the uIP stack. The increase in silicon area is only 9.7% and still this SoC is 2.57 times smaller and has 18.1 times less energy consumption compared to the Cortex-M3 baseline implementation.
机译:TCP / IP协议栈通常是复杂的协议,为了可靠的通信,需要大量的计算能力。因此,需要具有操作系统的功能强大且耗能的处理核心来实现高数据速率。在放置在高温环境中的通信系统中与汽车发动机或航空航天应用接近的电子设备,安装空间有限,发生的温度高达175℃,并且高能耗导致进一步的自热。因此,为了提供节能高效的小型处理平台,必须使用坚固的高温ASIC。 TCP / IP堆栈的特殊形式,例如轻型IP(lwIP)或微型IP(uIP),是为小型甚至嵌入式处理器而构建的,不需要操作系统。在这项工作中,我们在ARM Cortex-MO和ARM Cortex-M3处理器上实现了lwIP和uIP堆栈,并测量了为高温应用而设计的最终片上系统(SoC)的吞吐量。结果显示,即使使用lwIP堆栈的功能更强大的Cortex-M3处理器,吞吐量也相对较差,最高为20.29 MBit / s。诸如直接内存访问(DMA)机制和扩展的校验和硬件之类的软件和硬件改进可以将性能提高1250%,导致228 MBit / s。作为示例性目标应用,选择了高温环境中的电力线通信,并对能够在175℃下运行的180 nm SOI技术的可用物理参数进行了设计空间探索(DSE)。结果表明,性能最佳的处理器软件组合是Cortex-MO,它的大小仅为0.374 mm2,在运行uIP堆栈的电力线应用中,目标吞吐量为10 MBit / s时,功耗不到1 mW。与Cortex-M3基准实施方案相比,硅面积仅增加了9.7%,而该SoC仍然小2.57倍,能耗低18.1倍。

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