首页> 外文会议>Interconnect Technology Conference, 2009. IITC 2009 >Growth analysis of self-formed Ti-rich interface layers in Cu(Ti)/dielectric-layer samples using Rutherford Backscattering Spectrometry
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Growth analysis of self-formed Ti-rich interface layers in Cu(Ti)/dielectric-layer samples using Rutherford Backscattering Spectrometry

机译:使用卢瑟福反向散射光谱法分析Cu(Ti)/介电层样品中自形成的富Ti界面层的生长

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摘要

The Rutherford backscattering spectrometry (RBS) technique was employed for the growth investigation of Ti-rich interface layers in the annealed Cu(Ti) dielectric-layer . Growth behavior observed in RBS was similar to that in TEM. Thus, the RBS technique is indicated to be appropriate method for the growth analysis of the Ti-rich interface layers.
机译:Rutherford背散射光谱(RBS)技术用于退火的Cu(Ti)介电层中富Ti界面层的生长研究。 RBS中观察到的生长行为与TEM中相似。因此,表明RBS技术是用于富钛界面层的生长分析的合适方法。

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