Measurement system of film structure by interferometry and ellipsometry

摘要

We propose a novel combined measurement system for measuring surface and thickness profiles of multi-layered filmspecimens named as MYFIELM (Measurement sYstem of Film structure by Interferometry and ELlipsoMetry). Filmthickness profiles measured by ellipsometry mode are transferred to interferometry mode in MYFIELM and the surfaceprofile can be extracted from the spectral phase of the interferometry containing both of surface height andfilm thicknesses. For the verification, each performance of the operating mode was confirmed and 4 film layeredspecimen was measured in comparison of the reference values. To the best of our knowledge, MYFIELM is themost suitable solution for characterizing thin film structures with a textured substrate without any damage on thespecimen compared with the previous techniques even though it needs further improvements for stability and reliability.