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Metrology, Inspection, and Process Control for Microlithography XXXIII

Metrology, Inspection, and Process Control for Microlithography XXXIII

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1.Application of PSD for the extraction of programmed line roughness from SAXS

机译：PSD在从SAXS提取编程的线粗糙度中的应用
- 作者：Jérôme Reche;Maxime Besacier;Patrice Gergaud;Yoann Blancquaert
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
2.Area-framing optical defect review under optical resolution using multi-NA dark-field microscopy images

机译：使用多NA暗场显微镜图像在光学分辨率下检查区域框架光学缺陷
- 作者：Jun Ho Lee;Junhee Jeong;Chris Park;Byeong Geon You;Shin-Woong Park;Hwi Kim
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
3.In-depth analysis and research of additional components of the uncertainty budget using the finite element method

机译：有限元法对不确定性预算其他组成部分的深入分析与研究
- 作者：Vladimir Skliarov
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
4.Multi-Beam Inspection (MBI) for the 7nm Node and Beyond: Technologies and Applications

机译：适用于7nm及更高节点的多光束检测（MBI）：技术和应用
- 作者：Eric Ma;Kevin Chou;Martin Ebert;Xuedong Liu;Weiming Ren;Xuerang Hu;Martijn Maassen;Weihua Yin;Aiden Chen;Fei Wang;Oliver D. Patterson
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
5.Surface effects in simulations of scanning electron microscopy images

机译：扫描电子显微镜图像模拟中的表面效应
- 作者：L. van Kessel;C.W. Hagen;P. Kruit
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
6.Optical Characterization of multi-NST Nanowire Test Structures using Mueller Matrix Spectroscopic Ellipsometry (MMSE) based scatterometry for sub 5nm nodes

机译：使用基于Mueller矩阵光谱椭圆仪（MMSE）的散射法对5nm以下节点进行多NST纳米线测试结构的光学表征
- 作者：Madhulika Korde;Subhadeep Kal;Cheryl Pereira;Nick Keller;Aelan Mosden;Alain C. Diebold
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
7.Tilted beam SEM, 3D metrology for industry

机译：倾斜光束SEM，工业3D计量
- 作者：Charles Valadea;Jérôme Hazartb;Séastien Bérard-Bergeryb;Elodie Sungauera;MaximeBesacierc;Cécile Gourgon
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
8.YieldStar uDBO Overlay Metrology in Samsung D1y DRAM Volume Production

机译：YieldStar uDBO覆盖三星D1y DRAM量产中的计量技术
- 作者：Jang-Sun Kim;Jin-Moo Byun;Remco Lancee;Jong-Hyun Hwang;Hyun-Jun Ha;Kwang-Young Hu;Se-Ra Jeon;Won-Jae Jang;Hyung-Sub Son;Vidar van der Meijden;Marc Noot;Bartosz Foltynski;Lukasz Macht;Grzegorz Grzela;Cedric Grouwstra
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
9.Characterization of STEM Alignments and Their Automation

机译：STEM对准的特征及其自动化
- 作者：Ashley Tilson;Silvia Aerts
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
10.A diffraction-based overlay model based on FDTD method

机译：基于FDTD方法的基于衍射的叠加模型
- 作者：Buqing Xu;Ling Ma;Xiongfeng Zou;Lisong Dong;Yayi Wei
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
11.An Optimized Parameter Guidance System for Line/Space CD Metrology

机译：线/空间CD计量的优化参数制导系统
- 作者：Nan Zhao;Lingling Pu;Teng Wang;Wentian Zhou;Ming Xu;Wei Fang;Brian Lee
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
12.Engineered Neural Networks for improved defect detection and classification

机译：工程神经网络可改善缺陷检测和分类
- 作者：Dhruv Patel;Ravi Bonam;Assad A. Oberai
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
13.Deep learning's impact on contour extraction for Design Based Metrology and Design Based Inspection

机译：深度学习对基于设计的计量学和基于设计的检验的轮廓提取的影响
- 作者：Ryo Yumiba;Masayoshi Ishikawa;Shinichi Shinoda;Shigetoshi Sakimura;Yasutaka Toyoda;Hiroyuki Shindo;Masayuki Izawa
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
14.Detection of Particle Defect Components on Silicon Wafer with Laser Induced Breakdown Spectroscopy Combined Laser Cleaning Technology

机译：激光诱导击穿光谱技术结合激光清洗技术检测硅晶片上的颗粒缺陷成分
- 作者：Lituo Liu;Xiaoya Yu;Weihu Zhou;Guannan Li;Xiaomei Chen;Rongyi Ji
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
15.Using Gaussian process regression for effcient parameter reconstruction

机译：使用高斯过程回归进行有效的参数重建
- 作者：Philipp-Immanuel Schneider;Martin Hammerschmidt;Lin Zschiedrich;Sven Burger
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
16.High voltage CD-SEM based metrology for 3D-profile measurement using depth-correlated BSE signal

机译：基于高压CD-SEM的量度技术，可使用深度相关的BSE信号进行3D轮廓测量
- 作者：Wei Sun;Yasunari Sohda;Hiroya Ohta;Taku Ninomiya;Yasunori Goto
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
17.New Method removing SEM image noise to characterize CD LWR

机译：去除SEM图像噪声以表征CD和LWR的新方法
- 作者：Shinji Kobayashi;Satoru Shimura;Masashi Enomoto;Robert Kern;Timothy Diller;Tony McDaniel;Nan Qin;Thomas Reay;Roger Serwy
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
18.Spectroscopic reflectometry in the extreme ultraviolet for critical dimension metrology

机译：临界尺寸计量的极紫外光谱反射法
- 作者：Lukas Bahrenberg;Serhiy Danylyuk;Robert Michels;Sven Glabisch;Moein Ghafoori;Sascha Brose;Jochen Stollenwerk;Peter Loosen
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
19.First Demonstration of a 331-Beam SEM

机译：331光束SEM的首次演示
- 作者：C. Riedesel;I. Müller;N. Kaufmann;A. Adolf;N. Kämmer;H. Fritz;A. L. Eberle;D. Zeidler
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
20.Visualization of 3D structure of semiconductor devices by “Dig See” using GFIS-SIM

机译：通过使用GFIS-SIM的“ Dig＆See”可视化半导体器件的3D结构
- 作者：Shinichi Matsubara;Hiroyasu Shichi;Sayaka Tanimoto;Masami Ikota;TomihiroHashizume
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
21.Overlay run-to-run control based on device structure measured overlay in DRAM HVM

机译：基于设备结构的实测运行控制，基于DRAM HVM中测得的覆盖
- 作者：Hsiao Lun Chu;Foster Huang;Steven Tottewitz;Boris Habets;Patrick Lomtscher;Hsiao Lin Hsu;Afu Chiu;Rex H. Liu
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
22.Macro CDSEM 2D Metrology Supporting Advanced DRAM Patterning

机译：支持高级DRAM图案化的Macro CDSEM 2D计量
- 作者：R.Kris;G.Klebanov;I.Schwarzband;E.Sommer;L.Gershtein;B.Mathew;E.Noifeld;S.Levy;R.Alkoken;O.Novak;H.Miroku;D.Rathore;S.Pastur;S.Duvdevani-Bar;T.Bar-On;I.Horikawa
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
23.AI: From Deep Learning to In-Memory Computing

机译：AI：从深度学习到内存计算
- 作者：Hsiang-Lan Lung
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
24.Machine learning for predictive electrical performance using OCD

机译：使用OCD进行机器学习以预测电性能
- 作者：Sayantan Das;Joey Hung;Sandip Halder;Guillaume Schelcher;Roy Koret;Igor Turovets;Mohamed Saib;Anne-Laure Charley;Matthew Sendelbach;Avron Ger;Philippe Leray
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
25.Gas-enhanced PFIB surface preparation enabled metrology and statistical analysis of 3D NAND devices

机译：气体增强的PFIB表面制备可实现3D NAND设备的计量和统计分析
- 作者：Micah Ledoux;James Clarke;Brett Avedisian;Chad Rue;Umesh Adiga;Mark Biedrzycki
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
26.Contour based metrology, getting more from a SEM image

机译：基于轮廓的度量，从SEM图像中获取更多信息
- 作者：B. Le Gratiet;Regis Bouyssoua;J. Ducotéa;Christophe Dezauzier;Alain Ostrovsky;Charlotte Beylier;Christian Gardin;Paolo Petronib;Matthieu Milléquantb;Alexandre Chagoya-Garzonb;Patrick Schiavone
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
27.Tough road ahead for device overlay and edge placement error

机译：设备覆盖和边缘放置错误的艰难道路
- 作者：Kaustuve Bhattacharyya
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
28.Deep Learning Nanometrology of Line Edge Roughness

机译：线边缘粗糙度的深度学习纳米计量学
- 作者：Eva Giannatou;Vassilios Constantoudis;George Papavieros;Harris Papageorgiou;Gian Lorusso;Vito Rutigliani;Frieda Van Roey;Evangelos Gogolides
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
29.Nano-Scale Molecular Analysis of Photo-Resist Films with Massive Cluster Secondary Ion Mass Spectrometry

机译：大规模簇二次离子质谱法对光致抗蚀剂薄膜的纳米尺度分子分析
- 作者：Michael J. Eller;Mingqi Li;Xisen Hou;Stanislav V. Verkhoturov;Emile A. Schweikert;PeterTrefonas
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
30.Linewidth and Roughness Measurement of SAOP by Using FIB and Planer-TEM as Reference Metrology

机译：以FIB和Planer-TEM作为参考计量的SOAP线宽和粗糙度测量
- 作者：Kiyoshi Takamasu;Satoru Takahashi;Hiroki Kawada;Masami Ikota;Stefan Decoster;Frederic Lazzarino;Gian Lorusso
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
31.FEM simulation for artificial generation of SEM pictures

机译：人工生成SEM图片的有限元模拟
- 作者：Duy Duc Nguyen;Jean-Herve Tortai;Patrick Schiavoneb
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
32.Deep learning's impact on pattern matching for Design Based Metrology and Design Based Inspection

机译：深度学习对基于设计的计量学和基于设计的检验的模式匹配的影响
- 作者：Shuyang Dou;Shinichi Shinoda;Masayoshi Ishikawa;Ryo Yumiba;Shigetoshi Sakimura;Masanori Ouchi;Yasutaka Toyoda;Hiroyuki Shindo;Masayuki Izawa
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
33.First results from the Large dynamic range Atomic Force Microscope for overlay metrology

机译：大动态范围原子力显微镜用于叠加计量的首个结果
- 作者：G. Witvoet;J. Peters;S. Kuiper;A. Keyvani;R. Willekers
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
34.Study on a feasibility of dark-field illumination for the near-field microscope

机译：用于近场显微镜的暗场照明可行性的研究
- 作者：Hangyeong Oh;Woojun Han;Yungi Lee;Jaisoon Kim
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
35.Investigating process variability at ppm level using advanced massive eBeam CD metrology and contour analysis

机译：使用先进的大规模eBeam CD计量学和轮廓分析研究ppm级的工艺变异性
- 作者：B. Le-Gratiet;O. Mermet;C. Gardin;S. Desmoulins;T. Kiers;Y. Wang;P. Tang;D. Tien;F.Wang;C. Prentice;W. Tel;S. Hunsche
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
36.Depth Measurement Technique for Extremely Deep Holes using Back-Scattered Electron Images with High Voltage CD-SEM

机译：使用高压CD-SEM的背散射电子图像对极深孔的深度测量技术
- 作者：Takahiro Nishihata;Mayuka Osaki;Maki Tanaka;Takuma Yamamoto;Akira Hamaguchi;Chihiro Ida;Yusaku Suzuki
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
37.Enhanced Wafer Overlay Residuals Control; Deep Sub-Nanometer at Sub-Millimeter Lateral Resolution

机译：增强的晶圆覆盖残渣控制；亚毫米横向分辨率的深亚纳米级
- 作者：Avi Cohen;Philippe Leray;Eren Canga;Vladimir Dmitriev;Kujan Gorhad;Yael Sufrin
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
38.Novel method to achieve CD modeling in the presence of higher diu000braction orders

机译：在更高的订单数量下实现CD建模的新方法
- 作者：Phillip R. Atkins;Liequan Lee;Shankar Krishnan;Chi-Fu Yen;Shyh-Shii Pai;NickWeihan Chang;Hsien-Hung Chang;Li-Shiuan Tsai;Sheng-Yang Tseng;Jan-Hau Chang;Yung-Hsiang Lin;Chu-Han Chiu;Chun-Sheng Wu
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
39.Alignment sampling by thorough run-to-run simulation

机译：通过全面的运行间模拟进行比对采样
- 作者：Alex Ren;Ding Kai;Boris Habets;Steffen Guhlemann;Norman Birnstein;AlexanderMühle;Patrick Lomtscher;Rex Liu
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
40.Measuring after-etch overlay and characterizing tilt fingerprints in multi-tier 3D-NAND structures

机译：在多层3D-NAND结构中测量蚀刻后覆盖并表征倾斜指纹
- 作者：Hong-Goo Lee;Dong-Young Lee;Jun-Yeob Kim;Sang-Jun Han;Chan-Ha Park;Jaap Karssenberg;Mir Shahrjerdy;Arno van Leest;Nang-Lyeom Oh;Dong-Hak Lee;Aileen Soco;Tjitte Nooitgedagt
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
41.Statistical Significance of STEM based Metrology on Advanced 3D Transistor Structures

机译：基于STEM的先进3D晶体管结构计量学的统计意义
- 作者：Laurens Kwakman;Anne Kenslea;Hayley Johanesen;Jillian Cramer;Michael Strauss;WernerBoullart;Hans Mertens;Yong Kong Siew;Kathy Barla
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
42.Edge placement error measurement in lithography process with die to database algorithm

机译：模具到数据库算法在光刻过程中的边缘放置误差测量
- 作者：Yoshishige Sato;Shang-Chieh Huang;Kotaro Maruyama;Yuichiro Yamazaki
- 会议名称：《》 | 2019年
43.Image quality enhancement of a CD-SEM image using conditional generative adversarial networks

机译：使用条件生成对抗网络提高CD-SEM图像的图像质量
- 作者：Yoshihiro Midoh;Koji Nakamae
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
44.Application of aberration corrected low voltage SEM for metrology and inspection

机译：像差校正低压扫描电镜在计量检测中的应用
- 作者：Zh.H. Cheng;H. Dohi;S. Hayashi;K.Hirose;H. Kazumi
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
45.SEM Inspection and Review Method for Addressing EUV Stochastic Defects

机译：扫描电镜检查和审查方法以解决EUV随机缺陷
- 作者：Tal Itzkovich;Aner Avakrat;Shimon Levi;Omri Baum;Noam Amit;Kevin Houchens
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
46.Development of standard samples with programmed defects for evaluation of pattern inspection tools

机译：开发带有程序缺陷的标准样品，以评估图案检查工具
- 作者：Susumu Iida;Takamitsu Nagai;Takayuki Uchiyama
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
47.Localized Power Spectral Density analysis on Atomic Force Microscopy images for Advanced Patterning applications

机译：用于高级图案化应用的原子力显微镜图像上的局部功率谱密度分析
- 作者：Alain Moussa;Mohamed Saib;Sara Paolillo;Frederic Lazzarino;Andrea Illiberi;Shaoren Deng;Jan Willem Maes;Anne-Laure Charley;Philippe Leray
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
48.Smart implant-layer overlay metrology to enable fab cycle time reduction

机译：智能植入层覆盖量测技术可缩短晶圆制造周期
- 作者：Leon van Dijk;Faegheh Hasibi;Maialen Larrañaga;Anne Pastol;Auguste Lamb;Richard van Haren
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
49.New approach for APC and measurement sampler interaction in a complex process mix logic fab

机译：在复杂的工艺混合逻辑工厂中进行APC和测量采样器交互的新方法
- 作者：L. Lecarpentier;A. Mili;J. Decaunes;B. Le Gratiet
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
50.Focus budget improvement using optimized wafer edge settings

机译：使用优化的晶圆边缘设置来改善预算
- 作者：Lucas Lamonds;Bryan Orf;Michael Frachel;Xaver Thrun;Georg Erley;Philip Groeger;Alexander Muehle;Boris Habets
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
51.Applications of machine learning at the limits of form-dependent scattering for defect metrology

机译：机器学习在形式相关散射极限下的缺陷计量应用
- 作者：Mark-Alexander Henn;Hui Zhou;Richard M. Silver;Bryan M. Barnes
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
52.Parallel active cantilever AFM tool for high-throughput inspection and metrology

机译：并行有源悬臂AFM工具用于高通量检查和计量
- 作者：Mathias Holz;Christoph Reuter;Ahmad Ahmad;Alexander Reum;Tzvetan Ivanov;Elshad Guliyev;Ivo W. Rangelow;Ho-Se Lee
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
53.Analyze Line Roughness Sources Using Power Spectral Density (PSD)

机译：使用功率谱密度（PSD）分析线粗糙度源
- 作者：Lingling Pu;Teng Wang;Thomas J. Huisman;Ruben Maas;Maikel Goosen;Harm Dillen;Philippe Leray;Wei Fang
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
54.Quantitative tomography with Subsurface Scanning Ultrasound Resonance Force Microscopy

机译：地下扫描超声共振力显微镜的定量层析成像
- 作者：Maarten H. van Es;Laurent Fillinger;Hamed Sadeghian
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
55.Measurement system of film structure by interferometry and ellipsometry

机译：膜结构的干涉仪和椭圆仪测量系统
- 作者：Y. H. Yun;K. –N. Joo
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
56.Full structure transistor process monitoring of boron and germanium in PFET EPI using in-line XPS

机译：使用串联XPS对PFET EPI中的硼和锗进行全结构晶体管过程监控
- 作者：Jusang Lee;Ganesh Subramanian;Manasa Medikonda;Hossam Lazkani;Judson Holt;Churamani Gaire;Paul Isbester;Mark Klare
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
57.Edge Placement Error and Line Edge Roughness

机译：边缘放置误差和线边缘粗糙度
- 作者：Vassilios Constantoudis;George Papavieros;Evangelos Gogolides
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
58.Accurate vertical sidewall measurement by a metrological tilting-AFM for reference metrology of line edge roughness

机译：通过计量倾斜-AFM进行的精确垂直侧壁测量，可用于线边缘粗糙度的参考计量
- 作者：Ryosuke Kizu;Ichiko Misumi;Akiko Hirai;Satoshi Gonda
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
59.Verification and analysis of FEM for measurement of temperature distribution along the multilayer wall

机译：用于测量多层壁温度分布的有限元验证和分析
- 作者：Vladimir Skliarov;Pavel Neyezhmakov;Alexander Prokopov
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
60.Denoising line edge roughness measurements using Hidden Markov Models

机译：使用隐马尔可夫模型对线边缘粗糙度进行消噪
- 作者：George Papavieros;Vassilios Constantoudis;Ioannis Kontoyiannis;Evangelos Gogolides
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
61.Defect learning with predictive sampling for process improvement

机译：通过预测性采样进行缺陷学习以改进流程
- 作者：Ian Tolle;Julie Lee;Dave Salvador;Barry Saville;Poh-Boon Yong;Gino Marcuccilli
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
62.Influence of Sidewall Perturbations on CD-SEM Line Roughness Metrology

机译：侧壁扰动对CD-SEM线粗糙度测量的影响
- 作者：Benjamin D. Bunday;Chris A. Mack;Sergei Borisov;Vera Sinitsina
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
63.Intra-field alignment for overlay feed-forward simulation with sampling optimization

机译：场内对准，用于叠加前馈仿真和采样优化
- 作者：Cheng Hao Yang;Chun Chi Yu;Patrick Lomtscher;Martin Freitag;Steven Tottewitz;Boris Habets;Hsiao Lin Hsu;Rex H. Liu
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
64.Analysis and modelling of patterned wafer nano-topography using multiple linear regression on design GDS and silicon PWG data

机译：使用设计GDS和硅PWG数据的多元线性回归对带图案的晶圆纳米形貌进行分析和建模
- 作者：M. Kessar;B. Le-Gratiet;P. Lemaire;D. Le Cunff;V. Brouzet;V. Gredy
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
65.3D Optical Proximity Model Optimization Using inline 3DSEM Metrology

机译：使用在线3DSEM计量的3D光学邻近模型优化
- 作者：Shimon Levi;Ishai Schwarzban;Angela Karvtsov;Matan Tobayas;Hans-Jurgen Stock;Thomas Muelders;Sean Hand;Jason Osborne
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
66.e-beam inspection of single exposure EUV direct print of M2 layer of N10 node test vehicle

机译：N10节点测试车的M2层单次曝光EUV直接打印的电子束检查
- 作者：Sayantan Das;Ryo Shimoda;Shinji Mizutani;Sandip Halder;Kotaro Maruyama;Philippe Leray;Yuichiro Yamazaki
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
67.Overlay error investigation for metal containing resist (MCR)

机译：含金属抗蚀剂（MCR）的覆盖误差调查
- 作者：Roel Gronheid;Satomi Higashibata;Onur Demirer;Yusuke Tanaka;Dieter Van Den Heuvel;Ming Mao;Masaru Suzuki;Satoshi Nagaie;Waikin Li;Philippe Leray
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
68.Introduction

机译：介绍
- 作者：Vladimir A. Ukraintsev;Ofer Adan
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
69.Scatterometry and AFM measurement combination for Area Selective Deposition process characterization

机译：散射法和AFM测量组合用于区域选择性沉积工艺表征
- 作者：Mohamed Saib;Alain Moussa;Anne-Laure Charley;Philippe Leray;Joey Hung;Roy Koret;Igor Turovets;Avron Ger;Shaoren Deng;Andrea Illiberi;Jan Willem Maes;GabrielWoodworthd;Michael Strauss
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
70.Unbiased Roughness Measurements: Subtracting out SEM Effects, part 3

机译：无偏粗糙度测量：减去SEM效应，第3部分
- 作者：Chris A. Mack;Frieda Van Roey;Gian F. Lorusso
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
71.Roughness Decomposition: An on-Wafer Methodology to Discriminate Mask, Metrology, and Shot Noise Contributions

机译：粗糙度分解：一种晶圆上方法，用于区分掩模，度量衡和散粒噪声贡献
- 作者：Gian Francesco Lorusso;Gijsbert Rispens;Vito Rutigliani;Frieda Van Roey;Andreas Frommhold;Guido Schiffelers
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
72.High-resolution low-shrinkage CD metrology for EUV resist using high voltage CD-SEM

机译：使用高压CD-SEM的EUV抗蚀剂的高分辨率，低收缩CD计量
- 作者：Daisuke Bizen;Shunsuke Mizutani;Makoto Sakakibara;Makoto Suzuki;Yoshinori Momonoi
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
73.Color mixing in overlay metrology for greater accuracy and robustness

机译：叠加计量中的混色，以提高准确性和鲁棒性
- 作者：Simon Mathijssen;Marc Noot;Murat Bozkurt;Narjes Javaheri;Reza Hajiahmadi;AntoniosZagaris;Ken Chang;Benny Gosali;Eason Su;Cathy Wang;Arie den Boef;Kaustuve Bhattacharyya;Guo-Tsai Huang;Kai-Hsiung Chen;John Lin
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
74.Causal modeling of yield

机译：产量的因果模型
- 作者：Jeffrey Weintraub;Scott Warrick
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
75.CD and OCD sampling scheme optimization for HVM environment

机译：HVM环境的CD和OCD采样方案优化
- 作者：Chanha Park;Honggoo Lee;Dongyoung Lee;Ahlin Choi;Stefan Buhl;Wan-Soo Kim;Philip Gröger;Steffen Guhlemann;Seop Kim;Mingyu Kim
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
76.Evaluation of the accuracy and precision of STEM and EDS metrology on horizontal GAA nanowire devices

机译：评估水平GAA纳米线器件上STEM和EDS计量的准确性和精度
- 作者：Hayley Johanesen;Michael Strauss;Anne Kenslea;Chris Hakala;Laurens Kwakman;Werner Boullart;Hans Mertens;Yong Kong Siew;Kathy Barla
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
77.Standalone alignment technology enabling feed-forward compensation of on-product overlay errors

机译：独立对齐技术可对产品上的覆盖误差进行前馈补偿
- 作者：Takehisa Yahiro;Junpei Sawamura;Sonyong Song;Sayuri Tanaka;Yuji Shiba;Satoshi Ando;Hiroyuki Nagayoshi;Jun Ishikawa;Masahiro Morita;Yuichi Shibazaki
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
78.What is prevalent CD-SEM's role in EUV era?

机译：CD-SEM在EUV时代的主要作用是什么？
- 作者：WANG Zhigang;MOMONOI Yoshinori;SETOGUCHI Katsumi;SUZUKI Makoto;YAMAGUCHI Satoru
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
79.Metrology of 3D NAND in Electron Micrographs by Scale Space Snakes

机译：电子显微照片中尺度空间蛇的3D NAND计量
- 作者：Umesh Adiga;Michael Strauss;Ashley Tilson;Jason Arjavac;Jack Hagger;Justin Roller;Dan Nelson
- 会议名称：《》 | 2019年
80.Intra-field stress impact on global wafer deformation

机译：场内应力对整体晶圆变形的影响
- 作者：Richard van Haren;Ronald Otten;Subodh Singh;Amandev Singh;Leon van Dijk;David Owen;Doug Anberg;Jeffrey Mileham;Yajun Gu;Jan Hermans
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
81.Process window discovery methodology for extreme ultraviolet (EUV) lithography

机译：极紫外（EUV）光刻的工艺窗口发现方法
- 作者：Sandip Halder;Dieter Van Den Heuvel;Stephane Lariviere;Philippe Leray;Kaushik Sah;Andrew Cross;Antonio Mani
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
82.Process monitoring and control with tunable wavelength overlay coupled with simulation-to-measurement analysis

机译：可调波长覆盖和模拟到测量分析的过程监控
- 作者：Pedro Herrera;Kun Gao;Chen Dror;Eitan Hajaj;Alon Alexander Volfman;RavivYohanan;Vidya Ramanathan;Victoria Naipak;Renan Milo;Tal Yaziv;Nir BenDavid;Meng Wang;Hao Mei;Weihua Li;Xindong Gao;Dongyue Yang;Cheuk Wun Wong;Karsten Gutjahr;Xueli Hao;Tony Joung;Md Motasim Bellah;DeNeil Park;Yue Zhou;Abhishek Gottipati
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》
83.Improved accuracy and robustness for advanced DRAM with tunable multi-wavelength imaging and scatterometry overlay metrology

机译：通过可调多波长成像和散射测量叠加计量技术，提高了高级DRAM的准确性和鲁棒性
- 作者：Honggoo Lee;Sangjun Han;Minhyung Hong;Jieun Lee;Dongyoung Lee;Ahlin Choi;ChanhaPark;Dohwa Lee;Seongjae Lee;Jungtae Lee;Jeongpyo Lee;DongSub Choi;Sanghuck Jeon;Zephyr Liu;Hao Mei;Tal Marciano;Eitan Hajaj;Lilach Saltoun;Dana Klein;Eran Amit;Anna Golotsvan;Wayne Zhou;Eitan Herzl;Roie Volkovich;John C. Robinson
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》
84.OPC Model accuracy study using high volume contour based gauges and deep learning on memory device

机译：使用基于轮廓的量规和存储设备上的深度学习进行OPC模型精度研究
- 作者：Young-Seok Kim;SeIl Lee;Zhenyu Hou;Yiqiong Zhao;Meng Liu;Yunan Zheng;Qian Zhao;Daekwon Kang;Lei Wang;Mark Simmons;Mu Feng;Jun Lang;Byoung-Il Choi;Gilbert Kim;Hakyong Sim;Jongcheon Park;Gyun Yoo;JeonKyu Lee;Sung-woo Ko;Jaeseung Choi;Cheolkyun Kim;Chanha Park
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年
85.Process drift compensation by tunable wavelength homing in scatterometry-based overlay

机译：通过基于散射的叠加中的可调波长归零来进行过程漂移补偿
- 作者：Kun Gao;Pedro Herrera;Vidya Ramanathan;Victoria Naipak;Meng Wang;Renan Milo;Tal Yaziv;Nir BenDavid;Chen Dror;Hao Mei;Weihua Li;Xindong Gao;Linfei Gao;Md. Motasim Bellah;Karsten Gutjahr;Dongyue Yang;Cheuk Wun Wong;Xueli Hao;Tony Joung;DeNeil Park;Yue Zhou;Abhishek Gottipati
- 会议名称：《Metrology, Inspection, and Process Control for Microlithography XXXIII》 | 2019年

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