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Electronic speckle pattern interferometry for 3-D dynamic deformation analysis in industrial environments

机译:电子散斑干涉测量技术,用于工业环境中的3D动态变形分析

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Abstract: Electronic speckle pattern interferometry (ESPI) is applied to 3-D deformation mapping in practical problems from constructional engineering. The shrinking behavior and bonding ability of repair mortars applied in the restoration of historical stone buildings is monitored. Strategies are illustrated to process the huge amount of deformation data toward parameters characteristic of the relevant processes. Thus, ESPI is extended to routine applications in industrial inspection.!3
机译:摘要:针对建筑工程中的实际问题,将电子散斑干涉法(ESPI)应用于3D变形映射。监测用于修复历史石建筑的修补砂浆的收缩行为和粘结能力。说明了针对大量相关数据的特征参数处理大量变形数据的策略。因此,ESPI扩展到了工业检查中的常规应用。!3

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