首页> 外文会议>Infrared Systems and Photoelectronic Technology II; Proceedings of SPIE-The International Society for Optical Engineering; vol.6660 >VIS/SWIR Focal Plane and Detector Development at Raytheon Instruments Performance Data and Future Developments at Raytheon
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VIS/SWIR Focal Plane and Detector Development at Raytheon Instruments Performance Data and Future Developments at Raytheon

机译:雷神仪器性能数据的VIS / SWIR焦平面和检测器开发以及雷神仪器的未来发展

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Raytheon has developed SWIR and Visible-SWIR Focal Plane Arrays (FPAs) with over one million pixels that meet the demanding requirements of astronomy, night vision, and other low background systems. FPA formats are 1280 × 1024, 1024 × 1024 and 2048 × 2048, with detector elements on 20 μm pitch. This paper describes recent results on SWIR HgCdTe detectors, low-noise Readout Integrated Circuits (ROICs), and FPA imaging. SWIR HgCdTe detectors have been fabricated with cutoff wavelengths of 1.7 and 2.5 μm and have demonstrated high quantum efficiency and flat spectrals, including visible response to 400 nm. We compare InGaAs and HgCdTe detectors, and show HgCdTe passivation improvements which increase carrier lifetime fourfold over existing processes.
机译:雷神公司开发了具有超过一百万像素的SWIR和可见SWIR焦平面阵列(FPA),可以满足天文学,夜视和其他低背景系统的苛刻要求。 FPA格式为1280×1024、1024×1024和2048×2048,检测器元件间距为20μm。本文介绍了SWIR HgCdTe检测器,低噪声读出集成电路(ROIC)和FPA成像的最新结果。 SWIR HgCdTe检测器的截止波长为1.7和2.5μm,具有高量子效率和平坦光谱,包括对400 nm的可见响应。我们比较了InGaAs和HgCdTe检测器,并显示了HgCdTe钝化技术的改进,它使载流子寿命比现有工艺延长了四倍。

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