Advanced electro-thermal SPICE modeling of large power IGBTs

摘要

A novel IGBT electro-thermal model is implemented for the first time in PSpice for the simulation of steady state and transient temperature dependent IGBT operation including self-heating and latchup. A thermal circuit representing the characteristics of the IGBT package is developed and validated against a finite element model and experimental results. A novel electrical IGBT model based on the Kraus model is developed to account for the electrical impact of instantaneous junction temperature variations due to self-heating. The resulting electro-thermal model is validated against experimental dc and transient FBSOA measurements.