Convergence and Criticality in Electronics Thermal Management

摘要

1. Thermal management demands in electronics design continue to increase; 2. Product life cycles are shortened; 3. Power consumption and dissipation must be viewed from micro and macro level; 4. Acoustics, EMI, and optical packaging needs impinge on thermal solution design decisions and require integrated solutions; 5. Thermal solution capacity is application dependent; 6. Increased capacity and complexity increases system assembly cost; 7. Thermal solution vendors in transition: Resources versus risk assessment in rapidly changing markets; 8.The challenge: Manage increasing thermal solution complexity for cost without impacting performance.