VCSEL bonding to silicon and plastic substrates

摘要

Vertical cavity surface emitting lasers (VCSELs) are important light sources for communication and sensing applications. The materials used for fabricating VCSEL emitting at 650–1000 nm are typically limited to GaAs-based compounds. Increasingly III–V semiconductor photonic devices have been bonded to Si [1] and other substrates [2]. To extend the applications of VCSELs, we demonstrate a bonding approach [3] for VCSEL transfer onto foreign substrates. Our transfer process incorporates fully fabricated VCSEL arrays which do not require additional processing after bonding and optical characteristics are maintained after bonding. In this work, we demonstrate transfer of VCSEL arrays onto silicon and flexible plastic substrates.