SILICON SUBSTRATE DIRECT BONDING METHOD AND APPARATUS SYSTEM THEREOF SILICON SUBSTRATE DIRECT BONDING APPARATUS ALIGN PARTS VERIFICATION METHOD

摘要

The present invention provides a silicon substrate direct bonding method for bonding a silicon substrate with uniform contact. According to an aspect of the present invention, there is provided a method of directly joining a silicon substrate, comprising: loading a lower silicon substrate to a planar vacuum chuck of a lower stage, and forming an upper silicon substrate having flexibility on a downward convex curved surface vacuum chuck of an upper stage, A second step of raising the lower stage to contact the lower silicon substrate from one point (e.g., center) of the upper silicon substrate, a step of separating the upper silicon substrate from the lower convex curved surface vacuum chuck And a fourth step of further raising the lower stage to join the entire area of the lower silicon substrate and the upper silicon substrate from the one point to another part (e.g., outer edge).