Surface activation based nanobonding technologies for optoelectronics packaging

机译：基于表面活化的纳米封装技术，用于光电封装

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This article discusses the potential of surface activation based nanobonding technologies. Three-strategies of the nanobonding technologies with a number of applications such as the bonding of copper nanobumps, III–V materials and ionic materials have been discussed.

机译：本文讨论了基于表面活化的纳米键合技术的潜力。讨论了纳米键合技术的三种策略及其在许多应用中的应用，例如铜纳米凸点，III-V材料和离子材料的键合。

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来源
《IEEE LEOS Annual Meeting Conference Proceedings;LEOS '09》|2009年|55-56|共2页
会议地点 Belek-Antalya(TR);Belek-Antalya(TR)
作者
Howlader, M. M. R.;
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Electrical and Computer Engineering Department McMaster University 1280 Main Street West Hamilton ON L8S 4K1 Canada;

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关键词
Surface activation; interconnection; nanobonding; optoelectronics; packaging;

机译：表面活化；互连;纳米键光电子学打包;
入库时间 2022-08-26 14:40:54

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1. Surface activation-based nanobonding and interconnection at room temperature [J] . M. M. R. Howlader, A. Yamauchi, T. Suga Journal of Micromechanics and Microengineering . 2011,第2期

机译：室温下基于表面活化的纳米键和互连
2. Wire Bonding in Optoelectronics: Optoelectronic packages present unique challenges for wire bonding technology [J] . John Sprovieri Assembly . 2004,第4期

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3. Optoelectronic multichip module packaging technologies and optical input/output interface chip-level packages for the next generation of hardware systems [J] . Takahara H. IEEE journal of selected topics in quantum electronics . 2003,第2期

机译：下一代硬件系统的光电多芯片模块封装技术和光输入/输出接口芯片级封装
4. Surface Activation Based Nanobonding Technologies for Optoelectronics Packaging [C] . M. M. R. Howlader LEOS Annual Meeting . 2009

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5. Platform technologies for hybrid optoelectronic integration and packaging. [D] . Datta, Madhumita. 2002

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6. Safety assessment of the process ISAP Packaging based on Starlinger deCON technology used to recycle post‐consumer PET into food contact materials [O] . Claude Lambré, José Manuel Barat Baviera, Claudia Bolognesi, 2021

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7. Graphical Introduction of Interconnect and Packaging Technologies for Optoelectronic Devices 8). Alignment, a Synonym of an Optoelectronic Device Packaging. [O] . Masataka ITOH 1998

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8. Packaging Enhanced Optoelectronic Interconnects for Data Communications: High-performance Unidirectional Electrooptic Modulator Based on Polymeric Highly Multi-Mode Waveguides [R] . Chen, R. T. , Sun, D. , Lu, X. , 2000

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Surface activation based nanobonding technologies for optoelectronics packaging

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