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Improvement of sensitivity of ultrasonic beam induced resistance change (SOBIRCH) method with ultrasound resonance in mold resin

机译:模具树脂中通过超声共振提高超声束感应电阻变化(SOBIRCH)方法的灵敏度

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摘要

In some cases of failure analysis of semiconductor devices, package state analysis without mold decapsulation is required. The ultrasonic beam induced resistance change (SOBIRCH) method has been proposed to carry out the analysis without decapsulation. In the previous research, it was suggested by numerical simulation that ultrasonic resonance in mold resin improves the sensitivity of the SOBIRCH. In this report, the sensitivity improvement with ultrasound resonance was verified experimentally.
机译:在半导体器件故障分析的某些情况下,需要不进行模具解封装的封装状态分析。已经提出了超声束感应电阻变化(SOBIRCH)方法来进行分析而无需解封。在先前的研究中,通过数值模拟表明,模制树脂中的超声共振可提高SOBIRCH的灵敏度。在此报告中,通过超声证实了灵敏度的提高。

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