The construction of complex multichip modules requires a means ofevaluating the prototype for correct operation and characterization. Aflexible prototype method is described, using the overlay interconnectapproach, for probing and verification. The overlay process builds theinterconnect over the top of a bare die. An overview of the process isgiven. The overlay interconnect method has several major areas offlexibility that can be used to facilitate the prototyping of MCMs. Theability to access pads, either on the first layer for die verificationor on the top layer for control and observation, brings back part of theaccess for test that was lost in the size reduction. The ability to usethe pads to test a partitioned design and then add the finalinterconnect layer allows current designs to make the transition moreeasily to the MCM format. Many of the advantages of using the overlayprocess for prototyping are outlined
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