Die for MCMs: IC preparation for testing, analysis and assembly

摘要

A method of die preparation for test, analysis and burn-in isdescribed that can begin to address multichip module (MCM)infrastructure requirements for obtaining known good die. The processdeveloped provides full functional component testing, timing analysis atspeed, and burn-in of ICs prior to MCM insertion. A soluble polymeroverlay was coated on the die surface and patterned with new top levelmetal bond pads, allowing standard packaging, testing and burn-in whilepermitting a method of recovering selected devices for use in an MCM.The overlay formed a protective coating for the die and if left in placemay be used to support assembly specific metallization patterns andvarious metal finish types. A demonstration of this technique isreported and the component quality and analysis effort isdescribed