Thermal Characterization of an All-Active Microring Resonating Laser

摘要

Active microring optical devices are promising candidates for use in next generation optical signal processing and sensor products. In this design, an InP based microring laser is vertically coupled to a passive feeding waveguides using a waferbonding technology. The vertical coupling is expected to detrimentally affect the operating temperature and device performance through the low thermal conductivity of the bond material. Thus, a thermal analysis is undertaken in the design stage to better understand the implications of this fabrication process. A thermal analysis of a basic microring resonator of 50 μm radius and 100 mW power dissipation is presented and thermal design variations are discussed.