首页> 外文会议>High-Performance Ceramics III pt.1; Key Engineering Materials; vol.280-283 >On the Microstructure and Electrical Properties of Undoped and Antimony- Doped Tin Oxide Thin Film Deposited by Sol-Gel Process
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On the Microstructure and Electrical Properties of Undoped and Antimony- Doped Tin Oxide Thin Film Deposited by Sol-Gel Process

机译:溶胶-凝胶法沉积非掺杂锑掺杂氧化锡薄膜的微观结构和电学性能

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Undoped and antimony-doped tin oxide (ATO) thin films were prepared by sol-gel process in the solution of metal salts of tin (Ⅱ) chloride dehydrate and antimony tri-chloride. The microstructure of the thin films was analyzed by scanning electron microscope (SEM) and X-ray diffraction (XRD). Compared with undoped tin oxide, doped antimony tin oxide films coated glass substrate were homogeneous in composition and morphology after being sintered at different temperatures. Electrical behavior of the doped films was discussed in terms of sheet resistance measured by four point probe. From the experimental data, the sheet resistance of the films could be as low as 100-200Ω/□.
机译:在二水合氯化锡(Ⅱ)和三氯化锑的金属盐溶液中,通过溶胶-凝胶法制备了未掺杂和掺杂锑的氧化锡(ATO)薄膜。通过扫描电子显微镜(SEM)和X射线衍射(XRD)分析薄膜的微观结构。与未掺杂的氧化锡相比,掺杂锑的氧化锡薄膜涂覆的玻璃基板在不同温度下烧结后,其成分和形貌均一。根据四点探针测得的薄层电阻讨论了掺杂膜的电性能。根据实验数据,薄膜的薄层电阻可以低至100-200Ω/□。

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