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Thin AlGaN cladding, blue-violet InGaN laser diode with plasmonic GaN substrate

机译:薄AlGaN覆层,蓝紫InGaN激光二极管以及等离激元GaN

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We demonstrate the possibility of fabrication of InGaN laser diode with an extremely thin lower AlGaN cladding (200 run) by using high electron concentration, plasmonic GaN substrate. The plasmonic substrates were fabricated by one of high-pressure methods - ammonothermal method or multi-feed-seed growth method and have an electron concentration from 5×10~(19) cm~(-3) up to 1×10~(20) cm~(-3). New plasmonic substrate devices, in spite of their extremely thin lower AlGaN cladding, showed identical properties to these manufactured with traditional, thick lower cladding design. They were characterized by identical threshold current density, slope efficiency and differential gain. Thin AlGaN devices are additionally characterized by low wafer bow and very low density of dislocations (<10~4 cm~(-2)).
机译:我们证明了通过使用高电子浓度的等离激元GaN衬底制造具有非常薄的较低AlGaN覆层(200行程)的InGaN激光二极管的可能性。等离子基板是通过高压方法-氨热法或多进料种子生长法之一制造的,电子浓度从5×10〜(19)cm〜(-3)到1×10〜(20) )cm〜(-3)。尽管新型等离激元衬底器件的下部AlGaN覆层非常薄,但它们的性能却与采用传统的厚下部覆层设计制造的相同。它们的特征在于相同的阈值电流密度,斜率效率和差分增益。薄的AlGaN器件还具有低晶圆弯曲度和非常低的位错密度(<10〜4 cm〜(-2))的特点。

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