首页> 外文会议>Fifteenth International Symposium on Chemical Vapor Deposition, May 14-18, 2000, Toronto, Ontario >A BENCHMARK SOLUTION FOR MULTI-DIMENSIONAL THERMAL CVD MODELING WITH DETAILED CHEMISTRY
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A BENCHMARK SOLUTION FOR MULTI-DIMENSIONAL THERMAL CVD MODELING WITH DETAILED CHEMISTRY

机译:具有详细化学特征的多维热CVD建模的基准解决方案

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摘要

A benchmark solution is presented for 2-D simulations of of multi-component transport phenomena and multi-reaction chemistry in thermal CVD of silicon in a rotating disk/stagnation flow reactor. The results, which are validated against the 1-D SPIN code by Kee, Coltrin and coworkers, can be used as a benchmark against which (commercial) multi-dimensional CVD equipment simulation codes can be validated.
机译:提出了一个基准解决方案,用于在旋转盘/停滞式流动反应器中进行硅热CVD中的多组分传输现象和多反应化学的二维模拟。通过Kee,Coltrin和同事针对1-D SPIN代码进行验证的结果可以用作基准(可以验证(商业)多维CVD设备仿真代码的基准)。

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