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Carbon incorporation in Si_(1-y)C_y alloys grown by ultrahigh vacuum chemical vapor deposition

机译:通过超高真空化学气相沉积法在Si_(1-y)C_y合金中掺入碳

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Thin heteroepitaxial Si_(1-y)C_y films have been grown on Si (100) by Ultrahigh Vacuum Chemical Vapor Deposition (UHV/CVD) using silane and methlsilane as silicon and carbon precursors. Carbon incorporation has been studied in the growth temperature range of 550 deg C to 650 deg C. The layers have been characterized using high resolution X-ray diffraction and secondary ion mass spectrometry. The total carbon content of the alloys increases linearly with the methylsilane partial pressure and a methylsilane sticking coefficient approximately 2 times higher than that of silane was extracted. Layers with up to 1.34 percent substitutional carbon have been obtained at the lowest growth temperature. Fully substitutional carbon can be obtained for levels up to 0.65percent. Variations of the growth rate with temperature and carbon content are also discussed.
机译:通过使用硅烷和甲基硅烷作为硅和碳前体的超高真空化学气相沉积(UHV / CVD),在Si(100)上生长了异质外延Si_(1-y)C_y薄膜。已经在550℃至650℃的生长温度范围内研究了碳的掺入。已使用高分辨率X射线衍射和二次离子质谱法对这些层进行了表征。合金的总碳含量随甲基硅烷分压线性增加,并且提取出的甲基硅烷黏附系数约为硅烷的2倍。在最低的生长温度下已获得具有高达1.34%的取代碳的层。可以获得完全取代的碳,含量最高可达0.65%。还讨论了增长率随温度和碳含量的变化。

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