The Effect of Cutting Point Swivel Machining by Using Round Tool with Special Chamfer

摘要

Recently, in accordance with the technical development and miniaturization of the information equipments, the demand of optic elements with high precision and miniaturization is increased. The mold is used in the manufacture of the optic elements. Thus, it is needed to machine the mold with high efficiency and high precision. As the material of mold, hard material including cemented carbide and ceramics is used. However, it is a problem of the occurrence of severe tool wear when hard material is machined. To solve this problem, the cutting point swivel machining by using the diamond tool with special chamfer was proposed, which has the ability to suppress tool wear and to realize ultraprecise machining. It is confirmed that the cutting point swivel machining has the ability to suppress tool wear by the microgrooving experiment of SiC. This study aims at investigating the effect of the cutting point swivel machining, and making clear the relationship between tool rotation speed and tool wear. As a result, it is known that the actual cutting direction can be changed by using the cutting point swivel machining, and that the chipping of tool becomes conspicuous with increasing tool rotation speed.