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Additive Manufacturing of Photopolymers using the Texas Instruments DLP Lightcrafter

机译:使用德州仪器(TI)DLP Lightcrafter进行光敏聚合物的增材制造

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The use of the Texas Instruments DLP~® LightCrafter~(TM) as a compact module in lithography-based additive manufacturing technologies (AMT) is discussed in this paper. For this purpose the light engine is placed underneath a transparent vat which is coated with a PTFE-film and filled with photosensitive resin. By loading an appropriate bitmap into the light engine, the resin can be exposed selectively to obtain a photopolymerized layer. To integrate the device into the building process, a configurable I/O trigger is required since the loaded bitmap should be exposed only in a certain period (exposure time). By stacking up the individual layers with a typical layer thickness between 25 and 50um, a three-dimensional part is built up. The current setup of the used digital LEDs in combination with a customized optical projection system ensures a spatial and temporal homogeneity of the intensity at the build platform, which is significantly better than with traditionally used engines. It could be shown that this system can fabricate three-dimensional parts with a resolution < 40μm in x-y plane and 15μm in z-axis. Additionally, mechanical properties (e.g. bending strength) were measured and potential anisotropies, which might be caused by the layered manufacturing process, were assessed. Ceramic-filled polymers were also used and the necessary post-processing steps like the removal of the polymer phase after structuring and the final sintering step to obtain fully dense ceramic parts are discussed.
机译:本文讨论了在基于光刻的增材制造技术(AMT)中将德州仪器(TI)DLP®LightCrafter〜(TM)作为紧凑模块的用途。为此,将光引擎放置在透明桶的下方,该桶涂有PTFE膜并填充有光敏树脂。通过将适当的位图加载到光引擎中,可以选择性地对树脂进行曝光以获得光聚合层。要将设备集成到构建过程中,需要可配置的I / O触发器,因为加载的位图应仅在特定时间段(曝光时间)内暴露。通过堆叠典型厚度在25到50um之间的各个层,可以构建三维零件。所使用的数字LED的当前设置与定制的光学投影系统相结合,可确保构建平台上强度的空间和时间均匀性,这比传统上使用的引擎要好得多。可以证明,该系统可以制造三维零件,在x-y平面上的分辨率小于40μm,在z轴上的分辨率小于15μm。另外,测量了机械性能(例如弯曲强度),并且评估了可能由分层制造过程引起的潜在各向异性。还使用了陶瓷填充的聚合物,并讨论了必要的后处理步骤,例如在结构化后去除聚合物相以及最终烧结步骤以获得完全致密的陶瓷零件。

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