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Temperature scaling of CMOS analog design parameters

机译:CMOS模拟设计参数的温度缩放

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摘要

The scaling of key analog properties of CMOS technology under low-voltage conditions, in weak and moderate inversion, is investigated with emphasis on temperature behavior. Design parameters, such as weak inversion slope factor, threshold voltage, mobility, transconductance to current ratio, DIBL, and intrinsic gain, are examined with respect to bias conditions, geometry and temperature. Guidelines are provided to analog designers for the estimation of the variation of fundamental analog design parameters versus temperature. Measured data from NMOS and PMOS transistors of an advanced CMOS technology are provided.
机译:在弱和中等反转条件下,研究了低压条件下CMOS技术关键模拟特性的缩放,重点是温度行为。针对偏置条件,几何形状和温度,检查了设计参数,例如弱反演斜率因子,阈值电压,迁移率,跨导电流比,DIBL和固有增益。为模拟设计人员提供了指导,以估算基本模拟设计参数随温度的变化。提供了来自先进CMOS技术的NMOS和PMOS晶体管的测量数据。

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