Extending the roadmap beyond 3nm through system scaling boosters: A case study on Buried Power Rail and Backside Power Delivery

摘要

To ensure continuity in technology scaling, system level technology boosters will need to be introduced to complement Design-Technology Co-Optimization. We illustrate this evolution with the introduction of buried power rails and backside power delivery. These can provide 20% and 30% area scaling benefit respectively. Backside power delivery further improves IR drop providing up to 15% performance enhancement enabling PPAC scaling at system level.