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Practical evaluation of 16M-DRAMs production with i-line phase-shift lithography

机译:使用i-line相移光刻技术对16M-DRAM生产进行实际评估

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Abstract: We have fabricated 16M-DRAMs with i-line phase-shift lithography using 8 inch wafers. Edge-contrast enhancement type was used as a phase-shift reticle. The effects on i-line phase-shift lithography were evaluated for the patterns which have a small focus and alignment margin. It was found that the phase-shift lithography has a large effect on enlarging focus margin of small size patterns like 0.5 $mu@m. We evaluated the effect of phase- shift lithography by a trial manufacturing of 16M-DRAMs. As a result, i-line phase-shift lithography was found to have a possibility of high yield production of 16M-DRAMs. However, it was also found that there were several rejected pattern widths which were caused by variation of shifter width in the phase- shift reticle. So it is necessary to improve these rejected patterns for the application of this method to 16M-DRAMs.!4
机译:摘要:我们已经使用8英寸晶圆通过i-line相移光刻技术制造了16M-DRAM。边缘对比度增强型用作相移掩模版。对于焦点和对准裕度较小的图案,评估了对i线相移光刻的影响。已经发现,相移光刻对增大诸如0.5μm的小尺寸图案的聚焦裕度具有很大的影响。我们通过试制16M-DRAM评估了相移光刻的效果。结果,发现i-line相移光刻技术有可能高产量地生产16M-DRAM。然而,还发现,由于相移掩模版中的移位器宽度的变化而导致了几种不合格的图案宽度。因此有必要改进这些拒绝模式,以将这种方法应用于16M-DRAM。4

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