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Properties of Pulse Electrodeposited CuInSe_2 Films

机译:脉冲电沉积CuInSe_2薄膜的性能

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Copper Indium Selenide films were deposited by the pulse plating technique at different bath temperatures in the range of 30℃ -80℃ and at 50 % duty cycle (15s ON and 15s OFF). X-ray diffraction studies indicated the formation of single phase chalcopyrite copper indium selenide films. X-ray photoelectron spectroscopic studies indicated core levels of Cu 2p, In 3d and Se 3d. Atomic force microscope studies indicated that the surface roughness and grain size increased with duty cycle. The band gap of the films was in the range of 0.9 to 1.0 eV. The refractive index (n) and extinction co-efficient (k). values were determined from the transmission data. The n and k values are in the ranges of 2.68-1.78 and 0.43-0.083, respectively.
机译:通过脉冲电镀技术在30℃-80℃的不同浴温和50%的占空比(15s开和15s关)下沉积硒化铜铟薄膜。 X射线衍射研究表明形成了单相黄铜矿铜铟硒薄膜。 X射线光电子能谱研究表明Cu 2p,In 3d和Se 3d的核心水平。原子力显微镜研究表明,表面粗糙度和晶粒尺寸随占空比的增加而增加。膜的带隙在0.9至1.0eV的范围内。折射率(n)和消光系数(k)。从传输数据确定值。 n和k值分别在2.68-1.78和0.43-0.083的范围内。

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