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GROWTH OF MAGNESIUM OXIDE AND SCANDIUM OXIDE ON GaN FOR USE AS GATE AND FIELD PASSIVATION DIELECTRICS

机译:用作栅极和场钝化电介质的氧化镁和氧化锶在GaN上的生长

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摘要

The substrate preparation of gallium nitride, both ex-situ and in-situ, and the growth of magnesium oxide, MgO, and scandium oxide, Sc_2O_3, by plasma assisted gas-source molecular beam epitaxy (GSMBE) are presented. These oxides are employed as field passivation of AlGaN/GaN high electron mobility transistor (HEMT) devices and gate dielectrics for test diodes and metal oxide semiconductor HEMTs (MOSHEMTs). Ex-situ cleaning techniques include wet chemical etching and UV-ozone treatments and in-situ techniques include thermal and plasma treatments. Various growth recipes have been explored to produce MgO and Sc_2O_3 films with different morphologies and stoichiometry. The end result is a dielectric material with an oxideitride interface with low interface trap density and interface stability to allow for inversion to be demonstrated in GaN as well as reduce the current collapse phenomenon to minimum impact on HEMT device operation.
机译:介绍了等离子体辅助气体源分子束外延(GSMBE)制备的氮化镓的异位和原位基体,以及氧化镁MgO和氧化dium Sc_2O_3的生长。这些氧化物被用作AlGaN / GaN高电子迁移率晶体管(HEMT)器件的场钝化以及测试二极管和金属氧化物半导体HEMT(MOSHEMT)的栅极电介质。非原位清洗技术包括湿法化学蚀刻和紫外线臭氧处理,原位技术包括热处理和等离子处理。已经探索了各种生长配方以产生具有不同形态和化学计量的MgO和Sc_2O_3膜。最终结果是具有氧化物/氮化物界面的介电材料,该界面具有低的界面陷阱密度和界面稳定性,从而可以在GaN中进行反演,并将电流崩塌现象减少到对HEMT器件操作的影响最小。

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