THE IMPACT OF SINGLE WAFER PROCESSING ON PROCESS INTEGRATION

摘要

In this paper we have described the importance of single wafer processing (SWP) in process integration. As compared to batch processing, reduced cycle time, reduced processing temperature, and reduced defect densities are some of the attractive features of SWP. We have provided the example of new SWP tools that have the answers to address virtually all process integration issues in dealing with new materials as well as conventional materials in ultra small dimensions. Driven by reduced I/O pitches, and emergence of SOC and or SOP as the driver of semiconductor growth, SWP tools have started to play a important role in (he surface cleaning in IC assembly and packaging. Global acceptance of SWP in manufacturing can address the supply chain problem of the semiconductor industry.