Formulated systems based on epoxy resins are used extensively in electrical and electronic applications as either casting systems or electronic encapsulants. Among the principal attributes that such products provide is to facilitate the transfer of thermal energy that is generated within such devices to that of a heat sink. In such applications, it is necessary that these types of devices operate in a defined temperature range where dielectric losses are minimal and mechanical properties, including those of strength and thermal shock resistance, are maintained. This paper describes an epoxy system that has been formulated with highly thermally conductive inorganic fillers that is ideally suited for applications requiring good thermal management. This heat curing system features a thermal conductivity up to 2.7 W/m-k together with a very low coefficient of thermal expansion (12 ppm/k at 20/spl deg/C). It can be easily processed at moderate temperatures with good working life but can be cured rapidly at higher temperatures to a tough thermally stable polymer with excellent electrical and mechanical properties.
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