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A novel method for low impedance design of power and ground planes

机译:电源和接地层低阻抗设计的新方法

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摘要

To eliminate the noise propagation between the power and ground planes, we propose a method by applying absorbing materials in the package. In the proposed method, absorbing materials are placed on different locations between power and ground planes to verify and compare their performance of noise reduction. From the simulation results, the absorbing materials placed along the boundary of power and ground planes shows a better performance than other layouts at the low frequency, ranging from 0.1GHz to 3.4 GHz, whereas the absorbing materials placed around the via reveals a wonderful performance at the high frequency, ranging from 6 GHz to 10 GHz.
机译:为了消除电源和接地层之间的噪声传播,我们提出了一种通过在封装中施加吸收材料的方法。在提出的方法中,吸收材料被放置在电源和接地层之间的不同位置,以验证和比较它们的降噪性能。根据仿真结果,沿电源和接地层边界放置的吸收材料在低频范围从0.1GHz到3.4 GHz的情况下显示出比其他布局更好的性能,而在过孔周围放置的吸收材料则显示出出色的性能。高频,范围从6 GHz到10 GHz。

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