Education project for the development of curricula, research and prototyping facilities in the field of electronics interconnection and packaging

摘要

The preparation of electronics engineers for the 21st century's requirements in the field of microelectronics interconnection and packaging is a real challenge for today's education. An approach that provides appropriate lecture courses and practical experiments, initiates students into research projects, and teaches technology in a real prototype manufacturing environment, can hopefully achieve the main goals. A project for the development of the education has been started.