High Speed Data Acquisition and Pre-Processing System of the Photodetector Linear Array with through-Silicon Vias (TSVs) 2.5D/3D Integration

摘要

We been developing a micro spectrometer with embedded system customizable for high sensitive 64 pixels QDs-QW photodetectors linear array. Based on silicon substrate through silicon via (TSV) technology, the readout circuit chip and the photodetector linear array have been packaged on 2.5D/3D integration. The high-speed data acquisition and processing analysis unit system have designed and optimize in the system. For the design requirements of the miniature spectrometer data acquisition system, the high-resolution data acquisition system was designed by using the FPGA as the controlling core, and 16 bit analog-digital convertor for data acquisition. The multi-channel system has 100 Mbps speed of the serial data link and 12 MB/s data rate transmitted to the computer. High-speed data transmission circuit with USB2.0 or wireless network, direct memory access (DMA), and the PC software of the spectral acquisition were designed and adjusted together, which realized the real-time processing of spectral data. The spectral response of the mice skin from 400 nm to 800 nm has tested and verified. The measured results indicate that the micro spectrometer system has superior performance characteristics such as small pixel size, low noise, high-speed and low power dissipation.