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Order and defectivity nanometrology by image processing and analysis of sub-20 nm BCPs features for lithographic applications

机译:通过图像处理和亚20 nm BCPs功能的图像处理和分析,对光刻应用进行有序和缺陷纳米计量学

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摘要

The line patterns obtained by the self-assembly of the block copolymer (BCP) polystyrene-b-polyethylene oxide (PS-b-PEO) was investigated. The hexagonal PS-b-PEO 42k-11.5k in a thin film was solvent annealed in a chlorophorm saturated atmosphere for three different annealing times. The microphase segregation of this BCP returned 18nm cylinders of PEO through the PS matrix, with an approximately 40 n periodicity, as expected. Under chlorophorm vapours, the PEO cylinders oriented perpendicular to the silicon substrate while increasing the annealing time. These cylinders formed linear patterns with different alignment. To achieve insights about the percentage of alignment, defect type pareto and density, and order quantification to compare the three annealing recipes, the samples were analysed with innovative image analysis software specifically developed in our laboratory to identify elements and defects of line arrays from block copolymer self-assembly. From this technique, it was extracted dimensional metrology estimating pitch size and placement error, and the linewidth of the lines was estimated. Secondly, the methodology allows identification and quantification of typical defects observable in BCP systems, such as turning points, disclination or branching points, break or lone points and end points. The defect density and the quantification of the alignment were estimated using our technique. The methodology presented here represents a step forward in dimensional metrology and defect analysis of BCP DSA systems and can be readily used to analyze other lithographic or non-lithographic patterns.
机译:研究了通过嵌段共聚物(BCP)聚苯乙烯-b-聚环氧乙烷(PS-b-PEO)的自组装获得的线型。将薄膜中的六边形PS-b-PEO 42k-11.5k在氯仿饱和气氛中进行溶剂退火3次不同的退火时间。如预期的那样,该BCP的微相分离使18nm的PEO圆柱体通过PS矩阵返回,周期约为40 n。在绿化蒸气下,PEO圆柱体垂直于硅衬底定向,同时增加了退火时间。这些圆柱形成具有不同对准的线性图案。为了获得关于对齐百分比,缺陷类型的对比例和密度以及用于比较三种退火配方的阶次定量的见解,使用在我们实验室中专门开发的创新图像分析软件对样品进行分析,以从嵌段共聚物中识别线阵列的元素和缺陷自组装。从该技术中,提取了估计间距尺寸和放置误差的尺寸度量,并估算了线的线宽。其次,该方法可以识别和量化BCP系统中可观察到的典型缺陷,例如转折点,旋错或分支点,断裂或孤立点和终点。使用我们的技术估计缺陷密度和比对的量化。此处介绍的方法代表了BCP DSA系统的尺寸计量和缺陷分析方面的进步,可以轻松地用于分析其他光刻或非光刻图案。

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  • 会议地点 Baltimore MD(US)
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    Catalan Institute of Nanoscience and Nanotechnology ICN2, Campus de la UAB, Barcelona 08193, Spain;

    School of Mathematics and the Tyndall National Institute, UCC, Cork Ireland;

    Catalan Institute of Nanoscience and Nanotechnology ICN2, Campus de la UAB, Barcelona 08193, Spain,Green Nanotechnology Research Centre, Research Institute for Electronic Science, Hokkaido University, 001-0021 Sapporo, Japan;

    School of Mathematics and the Tyndall National Institute, UCC, Cork Ireland;

    School of Chemistry and the Tyndall National Institute, UCC, Cork Ireland,Centre for Research on Adaptive Nanostructures and Nanodevices, TCD, Ireland;

    Catalan Institute of Nanoscience and Nanotechnology ICN2, Campus de la UAB, Barcelona 08193, Spain,Catalan Institute of Research and Advanced Studies, Barcelona 08010 , Spain;

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