Chen Ying-Tung@Department of Mechatronic, Energy and Aerospace Engineering, National Defense University, Tahsi, Taoyuan 335, Taiwan--Sung James C.@KINIK Company, 64, Chung-San Rd., Ying-Kuo, Taipei Hsien 239, Taiwan;
National Taiwan University, Taipei 106, Taiwan;
National Taipei University of Technology, Taipei 106, Taiwan--Kan Ming-Chi@KINIK Company, 64, Chung-San Rd., Ying-Kuo, Taipei Hsien 239, Taiwan--Chang Hsiao-Kuo@KINIK Company, 64, Chung-San Rd., Ying-Kuo, Taipei Hsien 239, Taiwan;
National Cheng-Kung University, Tainan 701, Taiwan--Sung Michael@Advanced Diamond Solutions, Inc., 351 King Street Suite 813, San Francisco, CA 94158,USA--;
CMP; pad conditioner; diamond film; CVD; Moore's Law; 32 nm node;
机译:硅片和类金刚石碳膜与两个单层涂层硅片的摩擦机理
机译:垂直堆叠倒三角形和菱形硅纳米线(1?0)单晶硅晶片的新型制造
机译:热丝CVD在硅片上金刚石膜生长中温度和气体密度场分布的模拟
机译:硅晶片铸造钻石薄膜制造理想的钻石盘(IDD)的制造
机译:硅晶片上金刚石薄膜的热导率
机译:用树脂粘合金刚石锯锯制线速对相变硅晶片中的相变和残余应力的影响
机译:金刚石薄膜涂层硅盘对金属,陶瓷和天然金刚石的冷冻学