Thru Mold Via (TMV?) Package on Package Developmentand Surface Mount Validation

摘要

Amkor has qualified and is ramping production of the next generation Package onrnPackage (PoP) technology called Thru Mold Via (TMV?). In order to prepare for highrnvolume manufacturing of this new PoP package, Amkor undertook extensiverndevelopment and evaluations of Surface Mount Technology (SMT) for this new PoPrnstructure. Amkor methodically examined the relevant industry standard SMT practices,rnmaterials, and processes to create an evaluation matrix that encompassed most all majorrnend customer’s requirements. Flux materials and pastes, reflow profiles and environmentsrnfor the major SMT customers were analyzed and studied such that Amkor could replicaternthese practices in its own SMT lines to ensure the new TMV PoP technology, process andrnstructure was reliable and achieved 100% yields prior to final product launch. Thisrndevelopment effort allowed Amkor to create a more robust package technology and alsornensure the product would have rapid market acceptance and commercialization. Amkor’srnTMV? Package development focus was to ensure that it was compatible with thernaforementioned SMT standard practices. Amkor will present the summaries of the SMTrnprocess studies and the methods used to analyze and optimize both the package itself andrnthe SMT processes to achieve a high reliability and yield advanced technology to thernmarketplace.