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Integrated Layout Based Monte-Carlo Simulation for Design Arc Optimization

机译:基于集成布局的蒙特卡洛仿真,用于设计电弧优化

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Design rules are created considering a wafer fail mechanism with the relevant design levels under various design cases, and the values are set to cover the worst scenario. Because of the simplification and generalization, design rule hinders, rather than helps, dense device scaling. As an example, SRAM designs always need extensive ground rule waivers. Furthermore, dense design also often involves "design arc", a collection of design rules, the sum of which equals critical pitch defined by technology. In design arc, a single rule change can lead to chain reaction of other rule violations. In this talk we present a methodology using Layout Based Monte-Carlo Simulation (LBMCS) with integrated multiple ground rule checks. We apply this methodology on SRAM word line contact, and the result is a layout that has balanced wafer fail risks based on Process Assumptions (PAs). This work was performed at the IBM Microelectronics Div, Semiconductor Research & Development Center, Hopewell Junction, NY 12533.
机译:根据各种设计案例下具有相关设计级别的晶圆失效机制来创建设计规则,并设置这些值以涵盖最坏的情况。由于简化和泛化,设计规则阻碍(而不是帮助)密集的设备扩展。例如,SRAM设计始终需要广泛的基本规则豁免。此外,密集设计还经常涉及“设计弧”,这是设计规则的集合,其总和等于技术定义的临界间距。在设计弧中,单个规则更改可能导致其他违反规则的连锁反应。在本演讲中,我们介绍一种使用基于布局的蒙特卡洛模拟(LBMCS)和集成的多个基本规则检查的方法。我们将此方法应用于SRAM字线接触,结果是基于工艺假设(PA)的布局具有平衡的晶圆失效风险。这项工作是在纽约州霍普韦尔交界处,纽约州12533,半导体研究与开发中心的IBM微电子部完成的。

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