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A Layout Decomposition Algorithm for Self-Aligned Multiple Patterning

机译:自对准多图案的布局分解算法

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Self-aligned multiple patterning (SAMP) is a promising technology to scale IC devices to 7-nm half pitch and several 3-mask negative-tone SAMP processes for 2-D BEOL patterning applications have been proposed recently. In this paper, the existing coloring rules in self-aligned quadruple and sextuple patterning (SAQP and SASP) processes are re-examined first. We further discuss the geometric relation between various features and remove the unnecessary constraints, and develop improved layout decomposition algorithms for both processes. The cut-mask related overlay issue is addressed by proposing an edge-expansion solution when generating the cut patterns. Finally, we show that numerous standard Ml cells in the Open Cell Library, when slightly modified, can be successfully decomposed. This verifies the functionality of the new decomposition algorithms for continuous logic scaling to deep nano-scale using SAMP techniques.
机译:自对准多重图案(SAMP)是一种有前途的技术,可将IC器件缩放到7纳米半间距,并且最近已提出了几种用于2-D BEOL图案化应用的3-mask负极性SAMP工艺。在本文中,首先要重新检查自对准四元组和六元组图案(SAQP和SASP)过程中的现有着色规则。我们进一步讨论了各种特征之间的几何关系并消除了不必要的约束,并针对这两个过程开发了改进的布局分解算法。通过在生成切割图案时提出边缘扩展解决方案,可以解决与切割掩模相关的覆盖问题。最后,我们表明,在稍加修改的情况下,开放单元库中的许多标准M1单元都可以成功分解。这验证了新的分解算法的功能,该算法可使用SAMP技术将逻辑连续缩放至深纳米级。

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