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Semiconductor defect characterization in the Scanning Electron Microscope

机译:扫描电子显微镜中的半导体缺陷表征

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摘要

Defects in semiconductors usually act as sites of increased recombination and thus have a strong influence on the performance of microelectronic and optoelectronic devices. Among the variety of other techniques, both, the EBIC [ electron beam induced current ] as well as the CL [ cathodoluminescence ] have been proven to be powerful tools to localize the defects and characterize their electronic properties. In this paper these Scanning Electron Microscopy [ SEM ] are treated as quantitative research tools for defect investigation. Based on a review of the of the fundamental theoretical background for the quantitative analysis of the recombination properties the experimental requirements for a dedicated SEM are described. To demonstrate the capabilities of these techniques the investigation of gettering effects of dislocations in GaAs and the analysis of statistically distributed point-like defects in silicon arc presented.
机译:半导体中的缺陷通常是增加复合的部位,因此对微电子和光电器件的性能有很大的影响。在各种其他技术中,EBIC(电子束感应电流)和CL(阴极发光)均被证明是定位缺陷和表征其电子特性的有力工具。在本文中,这些扫描电子显微镜[SEM]被视为缺陷研究的定量研究工具。基于对用于重组性质的定量分析的基本理论背景的回顾,描述了专用SEM的实验要求。为了证明这些技术的功能,提出了GaAs中位错的吸杂效应的研究以及硅弧中统计分布的点状缺陷的分析。

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