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Modeling the effect of technology trends on the soft error rate of combinational logic

机译:模拟技术趋势对组合逻辑的软错误率的影响

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This paper examines the effect of technology scaling and microarchitectural trends on the rate of soft errors in CMOS memory and logic circuits. We describe and validate an end-to-end model that enables us to compute the soft error rates (SER) for existing and future microprocessor-style designs. The model captures the effects of two important masking phenomena, electrical masking and latching-window masking, which inhibit soft errors in combinational logic. We quantify the SER due to high-energy neutrons in SRAM cells, latches, and logic circuits for feature sizes from 600 nm to 50 nm and clock periods from 16 to 6 fan-out-of-4 inverter delays. Our model predicts that the SER per chip of logic circuits will increase nine orders of magnitude from 1992 to 2011 and at that point will be comparable to the SER per chip of unprotected memory elements. Our result emphasizes that computer system designers must address the risks of soft errors in logic circuits for future designs.
机译:本文研究了技术扩展和微体系结构趋势对CMOS存储器和逻辑电路中软错误率的影响。我们描述并验证了端到端模型,该模型使我们能够计算现有和将来的微处理器样式设计的软错误率(SER)。该模型捕获了两个重要的屏蔽现象的影响,即电气屏蔽和闭锁窗口屏蔽,它们可以抑制组合逻辑中的软错误。我们对SRAM单元,锁存器和逻辑电路中的高能中子产生的SER进行了量化,其特征尺寸为600 nm至50 nm,时钟周期为16至6个扇出4逆变器延迟。我们的模型预测,从1​​992年到2011年,逻辑电路的每芯片SER将增加9个数量级,届时将与未受保护的存储元件的每芯片SER相当。我们的结果强调,计算机系统设计人员必须解决逻辑电路中软错误的风险,以进行将来的设计。

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