Preparation and Property Study of Gold-Tin Alloys for Packaging of High Power Semiconductor Lasers

摘要

A novel fabrication method and process of Au(80wt.%)-Sn(20wt.%) eutectic alloys solder with excellent thermal, electrical and mechanical properties and relatively low melting and reflow temperature was presented, the characteristic of gold-tin alloy solder and the key technique to realize highly reliable bonding were discussed.